- Detailed discussion of electrochemical equipment for plating copper
- Updated information on tools used for evaporation, chemical vapor deposition, and plasma processes
- Emphasis on measurement of mechanical and thermal properties of insulators
- Recently reported methods for characterizing porous dielectric thin films
- Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides
- New process schemes based on the increased need for borderless contact gates and source/drain
- Expanded discussion on recently reported choices for low-dielectric insulators
- More emphasis on electroplated copper, especially morphology of plated films and their properties
- Recent developments in thin film liners and barriers
- Expanded material on copper reliability.